TECOM Announces High Performance Dual Patch Antenna (HPDPA) Volume Shipments

THOUSAND OAKS, CA (June 2007) - TECOM Industries, Inc. announces the release of a new series of High Performance Dual Patch Antennas (HPDPA) for Asset Tracking /SATCOM applications. The antenna covers the 1610 – 1626.5 MHz transmit and 2483.5 – 2500 MHz receive frequency bands and utilizes a proprietary design technique to obtain high isolation between bands. The antenna size is 3.5 inches in diameter and a very low profile of 1.5 inches in height. The HPDPA is designed in a weatherproof enclosure for land mobil or fixed use. The design is configurable with straight SMA connectors or with cable terminated with SMA connectors (2 each) in a direct mount or magnetic mount base. The (HPDPA) series of antennas can be configured to embed active receive and transmit circuitry without changing the total dimension of the antenna. The antenna has hemispherical gain coverage and an axial ratio better then 3 dB in the coverage range. The antenna has excellent low-angle performance close to the horizon, which allows for best in class connectivity to satellites.

"TECOM is pleased to be able to introduce this product and simultaneously announce production shipments of this product;” said TECOM’s Vice President of Marketing & Sales, Raju Chandra.

About TECOM Industries, Inc.

TECOM Industries, Inc., an ISO-9001 and AS9100 company, is headquartered in Thousand Oaks, CA. Established in 1971, the company designs and manufactures antennas and antenna systems for the aerospace, military, SATCOM and commercial wireless markets. TECOM's antenna products are used for Telemetry, SATCOM, Asset Tracking, Electronic Warfare, Direction Finding, Data Links, Positioning Systems and Embedded Commercial Wireless Applications.

TECOM Industries is a Smiths Interconnect business. SMiths Interconnect is part of the global technology business Smiths Group.

For more information about TECOM, call Toll Free (866) 840-8550 or visit the company's web site at www.tecom-ind.com.