Thousand Oaks, CA—September 12, 2004. TECOM Industries, Inc., a Smiths Interconnect company, today announced the launch of the HGA-9000 High Gain Antenna as its latest addition to the company's line of Satcom antenna products. This Best-in-Class low profile, fuselage-mounted antenna delivers significant improvement in performance and reliability for aircraft owners and fleet operators that are considering next generation on-board INMARSAT communications.

Based on advanced third generation phased array technology, the HGA-9000 meets current and future requirements including Aero-H/H+, Swift 64 HSD and Swiftbroadband (BGAN). With 18-20 dBic gain typical and16 dBic gain minimum, the HGA-9000 delivers higher data throughput and low angle coverage than existing Aero-H antennas.

Unique features of the HGA-9000 include a fully integrated beam steering unit (BSU) that simplifies installation of the system and distinguishes it as the only low profile, fuselage-mounted high gain antenna in a 2-LRU configuration. At 1.6" high, 12" wide and 28" long, this new product is the lowest profile and lightest weight (18 pounds) phased array available, meeting operator demands for reduced drag and fuel consumption. The antenna will be certified to RTCA/DO-160D environmental and RTCA/DO-178B Level D software.

Other products in Tecom's Satcom antenna product family include the IGA-2000 Aero-I Intermediate Gain antenna, the T-4220 C-130 Hatch Mount High Gain antenna, the T-4000 Aero-H High Gain antenna and the T-4100 Low Gain antenna.

About TECOM Industries, Inc.

Established in 1971, TECOM Industries, Inc. specializes in the design and manufacture of antennas and antenna systems for the wireless communications, RFID, SATCOM, aerospace, and military markets. For more information about TECOM, please call (805) 267-0100 or visit our web site at www.tecom-ind.com.

About Smiths Interconnect

Smiths Interconnect, a division of Smiths Group, is a global provider of electronic application specific components and sub-systems for the electronics interconnect, telecommunications, medical, industrial, aerospace as well as military and satellite markets worldwide.

Smiths Interconnect businesses comprise of; EMC Technology, Florida RF Labs, Hypertac Interconnect, LEA International, PolyPhaser, Radio Waves, Sabritec, Summitek Instruments, TECOM Industries Inc., Times Microwave Systems, TRAK Microwave, Transtector Systems, Smiths Interconnect Shanghai and Smiths Interconnect Japan. Each business is a leader in its field and trades under their own strong brand name.