Thousand Oaks, CA—September 27, 2004. TECOM Industries, Inc., a Smiths Interconnect company, today announced that TECOM has delivered its first Electronic Scanning Amplitude Comparison Direction Finding (ESADF) System for Electronic Sensor Measure (ESM) applications. This launches a new product line of electronically scanned direction finding antennas.

Each antenna assembly is mounted on a common mounting assembly, and connected to an inline limiter and Low Noise Amplifier.  These components are designed to meet customer requirements and can be bypassed if required.  The RF output from the TECOM ESADF system is provided on separate RF connectors to reduce system complexity.

About TECOM Industries, Inc.

Established in 1971, TECOM Industries, Inc. specializes in the design and manufacture of antennas and antenna systems for the wireless communications, RFID, SATCOM, aerospace, and military markets. For more information about TECOM, please call (805) 267-0100 or visit our web site at www.tecom-ind.com.

About Smiths Interconnect

Smiths Interconnect, a division of Smiths Group, is a global provider of electronic application specific components and sub-systems for the electronics interconnect, telecommunications, medical, industrial, aerospace as well as military and satellite markets worldwide.

Smiths Interconnect businesses comprise of; EMC Technology, Florida RF Labs, Hypertac Interconnect, LEA International, PolyPhaser, Radio Waves, Sabritec, Summitek Instruments, TECOM Industries Inc., Times Microwave Systems, TRAK Microwave, Transtector Systems, Smiths Interconnect Shanghai and Smiths Interconnect Japan. Each business is a leader in its field and trades under their own strong brand name.